Semiconductor and IC Packaging Material Market
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Semiconductor and IC Packaging Material Market By Type (Lead Frames, Bonding Wires, Ceramic Packages, Organic Substrates, and Others), By Packaging Technology (DFN, GA, QFN, SOP, and Others), and By Region - Global And Regional Industry Overview, market Intelligence, Comprehensive Analysis, Historical Data, And Forecasts 2024–2032
Category: Semiconductor & Electronics Report Format : PDF
Pages: 126 Report Code: ZMR-440
Published Date: Aug-2024 Status : Published
| Market Size in 2023 | Market Forecast in 2032 | CAGR (in %) | Base Year |
|---|---|---|---|
| USD 16.51 Billion | USD 34.12 Billion | 8.4% | 2023 |
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