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Die Attach Machine Market By Technique (eutectic, hybrid bonding, epoxy, soft solder, and others), By Type (flip chip bonder and die bonder), By Application (RF & MEMS, optoelectronics/photonics, logic, memory, CMOS image sensors, LED, and others) And By Region: - Global and Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, and Forecasts, 2023-2030
| Market Size in 2022 | Market Forecast in 2030 | Growth Rate (in %) | Base Year |
|---|---|---|---|
| USD 1236.58 Million | USD 2123.56 Million | CAGR at 7.14% | 2022 |
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