3D IC Market Towering To Reach New Height And Settle On USD 107.71 Billion By 2032

According to the report, the global 3D IC market size was valued at approximately USD 15.37 billion in 2023 and is predicted to reach around USD 107.71 billion by the end of 2032, expanding at a CAGR of around 21.5% from 2024 to 2032.

As per an analyst at Zion Market Research, requirement for ICT and consumer electronics are likely to boost the development 3D IC market in the near future. Moreover, rising number of portable devices such as tablets, smartphones, or laptops are some of the major reasons for propelling the growth of 3D IC market. Rising need for 3D ICs in sectors such as servers & data hubs and the military & aerospace sector along with increasing high-end computing market is also augmenting the development of 3D IC market.

Various M&A by market players is set to boost the development of 3D IC market in the years to come. For example, in December 2017, TE Connectivity purchased Hirschmann Car Communication for commercial & automotive vehicle applications, thereby driving the growth of 3D IC market.

Asia Pacific To Dominate The Global 3D IC Market In The Years To Come With More Than 40% Share

On the basis of application, the global 3D IC market is divided into military, information & communication technology, and others including consumer electronics. The information and communication technology sector grabbed the biggest share of the 3D IC market and added up to almost 26% of the 3D IC market in 2023. It is chased by consumer electronics and the military sector. ICT is also likely to carry on the same fashion in the years to come owing to the high acceptance of 3D IC integration tech.

3D IC market is divided based on the substrate employed as bulk silicon and silicon on insulator (SOI). SOI was the primary sector of 3D IC market and added up for the biggest share of the global 3D IC market in 2023. Bulk silicon sector is likely to exhibit moderate development in 3D IC market in the near future.

Asia Pacific obtained a bulk of 3D IC market in 2023. It added up to more than 40% share of the global 3D IC market in 2020. Asia Pacific chased Europe and North America in terms of growth for 3D IC market.

Some of the major companies in the global 3D IC market comprise Tezzaron Semiconductor Corporation, 3M Company, Taiwan Semiconductor Manufacturing Company, Ltd., Samsung, United Microelectronics Corporation, Xilinx, and STMicroelectronics amongst others. These players are set to bolster the global 3D IC market in the years to come.

Browse the full “3D IC Market By Product Type (LED, Memories, MEMS, Sensor, Logic, and Others), By Substrate Type (Silicon on Insulator (SOI) and Bulk Silicon), By Application (Information and Communication Technology, Military, Consumer Electronics, Others), and By Region: Global Industry Perspective, Comprehensive Analysis and Forecast, 2024 - 2032” Report at https://www.zionmarketresearch.com/report/3d-ic-market

The global 3D IC market is segmented as follows:

By Product Type

• LED
• Memories
• MEMS
• Sensor
• Logic
• Others

By Substrate Type

• Silicon on Insulator (SOI)
• Bulk Silicon

By Application

• Information and Communication Technology
• Military
• Consumer Electronics
• Others

By Region

• North America
  • The U.S.
  • Canada
• Europe
  • France
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Southeast Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • South Africa
  • Rest of Middle East & Africa

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