Global Circuit Materials Market Projected To Reach USD 52.42 Billion By The End Of 2032

According to analysts from Zion Market Research, the global circuit materials market was capitalized USD 36.26 Billion in 2023 and is forecast to attain USD 52.42 Billion by 2032, developing at a CAGR of 4.18% in the estimated period. The rising demand for circuit materials owing to technological innovations across the electronics segment is estimated to propel the market in the forecast period.

Some of the leading players functional in the circuit materials market are ITEQ Corporation, Shengyi Technology, Kingboard Laminates, Eternal Materials, DowDuPont, Jinan Guoji Technology, Taiflex Scientific, Rogers Corporation, Nikkan Industries, and Isola Group.

Rising Demand From Customer Electronics Industry To Boost The Circuit Materials Market

The global circuit materials market will witness technological developments in the electronics segment is a key driving force of the circuit materials market. The growth of the customer electronics industry resulted in the surging demand for LCD TVs, smartphones, and tablets that had been enhancing the sale of circuit materials. The rising awareness amongst consumers about the advantages of printed circuit boards, like low weight and compact design, over inflexible or conservative PCBs, is expected to enhance the circuit materials market in the forecasted period. In contrast, the less supply of copper foils is impacting the circuit materials market. The lethargic execution of technology in emerging economies is expected to hamper the worldwide circuit materials market in the forecasted period. The technological developments in developing countries are presenting development opportunities for the market.

The global circuit materials market is divided based on conducting material, material class, substrate, outer layer, applications, and geography. Based on material class, the market is divided into substrate, conducting material, and outer layer. Based on substrate, the market is classified into paper-phenolic, CEM, fiberglass-epoxy, polyimide, and others. Based on conducting materials, the market is categorized into copper and others. Based on the outer layer, the market is divided into dry film photoimageable, liquid ink photo imageable solder mask, and others. Based on applications, the market is divided into aerospace & defense, communications, industrial electronics, automotive, and others.

Asia Pacific Region To Record Massive Growth In The Global Circuit Materials Market

Based on the regional analysis, the global circuit materials market is bifurcated into Latin America, Europe, North America, Asia Pacific, and Middle East & Africa. The Asia Pacific is projected to be the chief market for circuit materials from 2020–2026. The rising demand from industrial electronics, communications, and automotive applications across the Asia Pacific is predicted to boost up the circuit materials market. The presence of ingrained producers of circuit materials in the Asia Pacific is a driving aspect for the market. The markets in North America and Europe are likely to develop considerably in the forecasted period. Europe region is a hub for automobiles.

Browse the full “Circuit Materials Market - By Material Class (Substrate, Conducting Material, and Outer Layer), By Substrate (Fiberglass-Epoxy, Paper-Phenolic, CEM, Polyimide, and Outer Layer), By Conducting Material (Copper and Outer Layer), By Outer Layer (Liquid Ink Photoimageable Solder Mask, Dry Film Photoimageable, and Outer Layer), By Application (Communications, Industrial Electronics, Automotive, Aerospace & Defense, and Outer Layer) And By Region - Global Industry Perspective, Comprehensive Analysis, and Forecast, 2024–2032.” Report at https://www.zionmarketresearch.com/report/circuit-materials-market

The global circuit materials market is segmented as follows:

By Material Class:

• Substrate
• Conducting Material
• Outer Layer

By Outer Layer:

• Liquid Ink Photo Imageable Solder Mask
• Dry Film Photoimageable
• Others

By Conducting Material:

• Copper
• Others

By Substrate:

• Fiberglass-Epoxy
• Paper-Phenolic
• CEM
• Polyimide
• Others

By Application:

• Communications
• Industrial Electronics
• Automotive
• Aerospace & Defense
• Others

By Region

• North America
  • The U.S.
  • Canada
• Europe
  • France
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Southeast Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • South Africa
  • Rest of Middle East & Africa

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