Global Outsourced Semiconductor Assembly and Testing Market Likely to Reach USD 50.9 Billion by 2028

The global Outsourced Semiconductor Assembly and Testing market size was estimated to be worth roughly USD 34.85 billion in 2021 and is predicted to grow to around USD 50.9 billion by 2028. The global Outsourced Semiconductor Assembly and Testing market is predicted to grow at a CAGR of roughly 4.8% during the forecast period.

Outsourced Semiconductor Assembly and Test refers to businesses that offer IC packaging and testing services to outside parties (OSAT). Before silicon devices created by foundries may be released on the market, OSAT service businesses package and inspect the devices. It primarily focuses on providing innovative test and packaging solutions to semiconductor businesses in well-established markets like consumer and computer, wearables, automotive, and the Internet of Things (IoT).

People are using electronics more frequently as a result of growing transformation in industrialized countries and a surge in smartphone adoption, which is driving demand for outsourced semiconductor assembly and testing globally. Additionally, the development of technology and the growing purchasing power of emerging nations both contribute to the OSAT expansion. Furthermore, as OSAT companies dominate IC assembly and testing, industry players have numerous options to strengthen their market position.

Automotive applications are one of the fastest-growing income streams for the global outsourced semiconductor assembly and testing market. The complexity of automotive chips is rapidly rising, along with the complexity of automotive chip packaging, with the advent of electric cars, driverless cars, and ADAS systems. OSAT vendors are required because in-cabin applications such as entertainment systems and advanced driving assistance systems (ADAS) have stringent mission-critical test specifications.

However, the majority of printed circuit boards and other electronic devices are made by third-party companies. However, a lot of unanticipated costs and risks are sometimes overlooked in an effort to boost profitability and appease shareholders. Furthermore, a lot of third-party service providers do not meet the high standards of assembly or testing requirements for semiconductor goods. Additionally, the majority of outsourcing took place in Asian nations like China, where many service providers do not respect intellectual property laws, putting OEMs at risk of losing crucial procedures.

The global outsourced semiconductor assembly and testing market is segmented based on process, application, and region.

Based on process, the market is segmented into sawing, sorting, testing, and assembly. Now that testing is being outsourced to several Outsourced Semiconductor Assembly and Test facilities, semiconductor manufacturers are moving more quickly. This change has occurred as a result of manufacturers looking for more and better ways to reduce operating expenses and hasten the launch of their new product ideas.

Basic semiconductors are assembled to create completed semiconductors. It facilitates electrical connections, heat dissipation, and die protection. The fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D, and 3D packaging, system in package (SiP), and copper wire bonding are only a few of the services offered in the assembly or packaging industry.

With about 55% of the market share, Asia Pacific dominated the global outsourced semiconductor assembly and testing market. China has a monopoly on the regional market among all the nations in the area. In addition, compared to other countries, China has a very large market share.

This is attributed to the country's robust economic growth, consumer spending power, the presence of significant electronic manufacturing companies, and the growing use of smartphones. The United States is one of the most significant markets for the OSAT industry. OSAT business in the nation is expanding as a result of significant investments, technical advancements, and the creation of new applications.

List of prominent players in the global outsourced semiconductor assembly and testing market

• ASE Group
• Amkor
• JCET
• Siliconware Precision Industries Co., Ltd.
• KYEC
• Hana Micron
• Signetics
• Unisem Group
• Walton Advanced Engineering
• Powertech Technology Inc.
• Others      

Recent Developments:

In November 2021, Tata Group revealed that in India, it aims to build a $300 million semiconductor manufacturing and testing facility. Tata's initial foray into the burgeoning chip business would be through the outsourced semiconductor assembly and test (OSAT) factory.

In February 2021, Siemens Digital Industries Software has announced the release of two new enablement solutions developed in collaboration with Advanced Semiconductor Engineering, Inc. (ASE) to assist mutual customers in creating and evaluating multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an incredibly simple, data-robust graphical environment before and during physical execution of the design.

This review is based on a report by Zion Market Research, titled “Outsourced Semiconductor Assembly And Testing Market By Process (Sawing, Sorting, Testing, And Assembly), By Packaging Type (Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, And Quad & Dual), By Application (Consumer Electronics, Industrial, Telecommunication, Automotive, Aerospace & Defense, Medical & Healthcare, And Logistics & Transportation) And By Region – Global And Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data And Forecasts 2022 – 2028.”- Report at https://www.zionmarketresearch.com/report/outsourced-semiconductor-assembly-and-testing-market

Global Outsourced Semiconductor Assembly and Testing market is segmented as follows:

By Process

• Sawing
• Sorting
• Testing
• Assembly

By Packaging Type

• Ball Grid Array
• Chip Scale Package
• Multi Package
• Stacked Die
• Quad & Dual

By Application

• Consumer electronics
• Industrial
• Telecommunication
• Automotive
• Aerospace and defense
• Medical and Healthcare
• Logistics and Transportation

By Region

• North America
  • The U.S.
  • Canada
• Europe
  • France
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Southeast Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • South Africa
  • Rest of Middle East & Africa

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