Global Semiconductor Bonding Market Is Predicted to Surge Approximately $3.9 Billion By 2030

Global Semiconductor Bonding Market Growth, Share, Analysis, and Forecast to 2030

The global semiconductor bonding market size was nearly $1.8 Billion in 2022 and is predicted to surge to approximately $3.9 Billion by 2030 apart from recording a CAGR of nearly 3.12% in 2023 - 2030.

Semiconductor is a substance with key electric features enabling it to serve computers and electronic equipment production. Moreover, it is a solid chemical product conducting electricity under specific conditions. Semiconductors find lucrative applications in defense tools, communication systems, transport, computing, healthcare, and renewable energy. The arrangement of semiconductors includes the bonding of atoms in the making of a large number of integrated circuits as well as fabrication equipment. The structure of semiconductor material is homogeneous and is the same throughout the semiconductor bonding model.

Escalating demand for micro-electromechanical systems and growing preference for electric vehicles will expedite the expansion of the semiconductor bonding market globally. Increasing acceptance of stacked die systems in connected things will proliferate the size of the global semiconductor bonding market. Onset of the 5G network along with a rise in the research on developing the 6G network will help the semiconductor bonding market expand leaps & bounds across the globe. Increase in the use of smartphones and wearable devices will boost global market trends. Apart from this, with semiconductors finding a slew of applications in connected logistics, building & home automation, smart mobility, and smart transport, the market for semiconductor bonding is predicted to gain traction in the years ahead.

Nevertheless, high ownership costs can impede the global semiconductor bonding industry surge. However, the massive preference for semiconductors in packaging and 3D semiconductor assembly along with demand for the product in AI & IoT will open new horizons of growth for the global industry. This, in turn, will offset the impact of a hindrance on the expansion of the global semiconductor bonding business.

The global semiconductor bonding market is divided into process type, type, application, bonding technology, and region. 

In terms of process type, the market for semiconductor bonding is segmented into die-to-wafer bonding, die-to-die bonding, and wafer-to-wafer bonding segments. Furthermore, the die-to-wafer bonding segment is predicted to account for the major share of the global market over the anticipated period. The segmental growth can be owing to its proven success in CMOS image sensors as well as other memory & logic systems. Moreover, the use of die-to-wafer bonding in the heterogeneous integration phase will further steer the segmental expansion.

In terms of type, the global semiconductor bonding market is sectored into flip chip bonder, die bonder, and wafer bonder segments.

On basis of bonding technology, the semiconductor bonding market across the globe is segmented into wafer bonding technology and die bonding technology segments.

On basis of application, the semiconductor bonding industry across the globe is bifurcated into 3D NAND, RF Devices, LED, CMOS Image Sensors, and MEMS & Sensors segments. Moreover, the LED segment, which contributed the largest industry share in 2022, will lead the application space in the ensuing period. The segmental expansion can be due to the directional nature & high efficacy of LED. Furthermore, LEDs are utilized in parking garage lighting, outdoor area lighting, street lights, task lighting, modular lighting, and refrigerated case lighting. Moreover, LED is used in households for cove lighting, thereby boosting the demand for LEDs in the residential sector.

Furthermore, the semiconductor bonding market in North America is anticipated to lead the global market in the forthcoming years. The expansion of the market in the sub-continent can be due to a rise in the trend of using hybrid and electric vehicles in the counties such as the U.S. and Canada.

The semiconductor bonding market in the Asia-Pacific is slated to register the highest CAGR over the forecast timeframe. The regional market growth in the ensuing years can be due to the thriving capacitive tactile sensor industry in the countries such as China. A large number of firms in the sub-continent are trying to manufacture next-gen semiconductor bonding solutions including wafer bonding and gold wire bonding solutions. In addition to this, the presence of key manufacturers and suppliers of semiconductors in countries such as China, Taiwan, and South Korea will contribute majorly to the revenue of the semiconductor bonding market in the Asia-Pacific zone.

This review is based on a report by Zion Market Research, titled “Semiconductor Bonding Market - By Type (Die Bonder, Wafer Bonder, And Flip Chip Bonder), By Application (RF Devices, 3D NAND, CMOS Image Sensors, LED, And MEMS & Sensors), By Process Type (Die-To-Die Bonding, Wafer-To-Wafer Bonding, And Die-To-Wafer Bonding), By Bonding Technology (Die Bonding Technology And Wafer Bonding Technology), And By Region - Global And Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, And Forecasts 2023 – 2030.”- Report at https://www.zionmarketresearch.com/report/semiconductor-bonding-market

Recent Developments:

• In the second quarter of 2021, ASM Pacific Technology, a key semiconductor chip assembly manufacturing firm based in Singapore,  introduced three new manufacturing tools with high precision die bonding techniques and micro-transfer printing technologies for enabling heterogeneous amalgamation of ultra-thin die ranging up to 300mm wafer base. The initiative will boost the scope of semiconductor bonding demand in Asia in the forthcoming years.
• In the second half of 2020, Palomar® Technologies, a key U.S.-based supplier of automated microelectronic assembly equipment and contract assembly solutions, introduced thermosonic, fully automated, and high-speed wire bonder The move will expedite the semiconductor bonding industry in North America.

Key players in the global semiconductor bonding industry include:

• Kulicke & Soffa
• Moschip Technologies Ltd
• Tata Elxsi Ltd
• Shinkawa Ltd
• Shibaura Mechatronics
• Yamaha Motor Robotics Corporation Co.
• Fuji Corporation
• SPEL Semiconductor Ltd
• Panasonic Corporation
• SUSS MicroTech SE
• ASM Pacific Technology Ltd.
• Fasford Technology
• EV Group
• Ruttonsha International Rectifier Ltd
• Dixon Technologies (India) Ltd
• BE Semiconductor Industries N.V.

The global semiconductor bonding market is segmented as follows:

By Type

• Die Bonder
• Wafer Bonder
• Flip Chip Bonder

By Application

• RF Devices
• 3D NAND
• CMOS Image Sensors
• LED
• MEMS & Sensors

By Process Type

• Die-to-Die Bonding
• Wafer-to-Wafer Bonding
• Die-to-Wafer Bonding

 By Bonding Technology

• Die Bonding Technology
• Wafer Bonding Technology

By Region

• North America
  • The U.S.
  • Canada
• Europe
  • France
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Southeast Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • South Africa
  • Rest of Middle East & Africa

About Us:

Zion Market Research is an obligated company. We create futuristic, cutting-edge, informative reports ranging from industry reports, the company reports to country reports. We provide our clients not only with market statistics unveiled by avowed private publishers and public organizations but also with vogue and newest industry reports along with pre-eminent and niche company profiles. Our database of market research reports comprises a wide variety of reports from cardinal industries. Our database is been updated constantly in order to fulfill our clients with prompt and direct online access to our database. Keeping in mind the client’s needs, we have included expert insights on global industries, products, and market trends in this database. Last but not the least, we make it our duty to ensure the success of clients connected to us—after all—if you do well, a little of the light shines on us.

Contact Us:

Zion Market Research
244 Fifth Avenue, Suite N202
New York, 10001, United States
Tel: +49-322 210 92714
USA/Canada Toll-Free No.1-855-465-4651
Email: sales@zionmarketresearch.com
Website: https://www.zionmarketresearch.com