3D Mobile Sensing Hardware Market Size, Share, Demand, Growth Analysis, Forecast 2032

3D Mobile Sensing Hardware Market

3D Mobile Sensing Hardware Market by Type (External sensors and Built-in (Embedded and Internal)), by Product (MEMS, Pressure sensors, Microphones, and Environmental sensors), by Application (Consumer Electronics, Security & Surveillance, Healthcare, Entertainment, Aerospace & Defense, Automotive, Industrial Robotics, and Others), and By Region: Global Industry Perspective, Comprehensive Analysis and Forecast, 2024– 2032

Category: Technology & Media Report Format : PDF Pages: 209 Report Code: ZMR-3202 Published Date: May-2024 Status : Published
Market Size in 2023 Market Forecast in 2032 CAGR (in %) Base Year
USD 3.45 Billion USD 27.24 Billion 25.80% 2023

3D Mobile Sensing Hardware Market

3D Mobile Sensing Hardware Market: Industry Perspective

The global 3D Mobile Sensing Hardware Market size was worth around USD 3.45 Billion in 2023 and is predicted to grow to around USD 27.24 Billion by 2032 with a compound annual growth rate (CAGR) of roughly 25.80% between 2024 and 2032.

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Rich sensor mobile phones or 3D mobile sensing systems have made possible the recent evolution of the mobile sensing research sector as a part of ubiquitous sensing that combines other areas such as web sensing and web sensor networks. The 3D mobile sensing object can be people-centered or environmental-centered and the sensing domains could be urban, vehicular, home, and others. The 3D sensing solutions that are now available in the market include Google’s Tango, Intel’s RealSense, and the REAL3 image sensor. The major technology companies such as Infineon and PMD Technologies are jointly working on these solutions to accelerate their entry into the associated application market. Moreover, Qualcomm Technologies, Inc. and Himax Technologies, Inc. also announced their joint venture for the same. The deals and the activities done by these solution developers are expected to boost the demand for related hardware. This process also benefitted other component suppliers such as AMS AG, Heptagon, and Lumentum Operations LLC.

The report analyzes and forecasts 3D mobile sensing hardware market on a global and regional level. The study offers past data from 2018 to 2023 along with forecast from 2024 to 2032 based on revenue (USD Billion). Assessment of 3D mobile sensing hardware market dynamics gives a brief thought about the drivers and restraints for the 3D mobile sensing hardware market along with the impact they have on the demand over the years to come. Additionally, the report also includes the study of opportunities available in the 3D mobile sensing hardware market on a global level.

Global 3D Mobile Sensing Hardware Market: Growth Factors

The rising adoption of pressure sensors among consumers and robust sales of smartphones and tablets have accelerated the development of the global 3D mobile sensing hardware market. The booming Chinese smartphone markets and acceleration in the adoption of the internet of things (IoT) are also some of the factors propelling the growth of this market. Also, the rapid technological advancements are opening up a plethora of new applications across different industry verticals where 3D mobile sensing hardware can be used. Moreover, the focus on new product developments such as infra-red (IR) or multispectral imaging and gas sensors offers a potential opportunity to the market. However, the limitation in the adoption of 3D sensing technology and risk of commoditization is anticipated hampering the demand for the market. Furthermore, the momentum in the market growth for 3D mobile sensing hardware will depend on component suppliers and smartphone makers. In addition, the development of third-party applications will be influential in raising the overall growth ratio of 3D mobile sensing hardware market.

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The report gives a transparent view of the 3D mobile sensing hardware market. We have included a detailed competitive scenario and portfolio of leading vendors operative in the global 3D mobile sensing hardware market. To understand the competitive landscape in the 3D mobile sensing hardware market, an analysis of Porter’s Five Forces model for the 3D mobile sensing hardware market has also been included. The report also covers patent analysis with bifurcation into a patent trend, patent by company and patent by region. The study encompasses a market attractiveness analysis, wherein type, product, application, and regional segments are benchmarked based on their market size, growth rate, and general attractiveness.

3D Mobile Sensing Hardware Market: Report Scope

Report Attributes Report Details
Report Name 3D Mobile Sensing Hardware Market Size Report
Market Size in 2023 USD 3.45 Billion
Market Forecast in 2032 USD 27.24 Billion
Growth Rate CAGR of 25.80%
Number of Pages 188
Forecast Units Value (USD Billion), and Volume (Units)
Key Companies Covered Infineon Technologies, PMD Technologies, Qualcomm Technologies, Inc., Himax Technologies, Inc., AMS AG, Sunny Opotech Co., Ltd., Heptagon, Lumentum Operations LLC, Microsoft Corporation, Google LLC, Lenovo, and Apple Inc., among others.
Segments Covered By Type, By Product , By Application, and By region
Base Year 2023
Historical Year 2018 to 2022
Forecast Year 2024 - 2032
Customization Scope Avail customized purchase options to meet your exact research needs. Request For Customization

Global 3D Mobile Sensing Hardware Market: Segmentation

The study provides a crucial view of the 3D mobile sensing hardware market by segmenting the market based on type, product, application, and region. All the segments of 3D mobile sensing hardware market have been analyzed based on present and future trends and the market is estimated from 2018 to 2024.

Based on the type, global 3D mobile sensing hardware market is bifurcated into external sensors and built-in (embedded, internal). MEMS (microelectromechanical system) inertial sensors, pressure sensors, microphones, environmental sensors, fingerprint, ALS (ambient light sensing), and CMOS are the product segments of the global 3D mobile sensing hardware market.

Based on application, the market is divided into consumer electronics, security & surveillance, healthcare, entertainment, aerospace & defense, automotive, industrial robotics, and others.

Regional Analysis

The regional segmentation comprises the current and forecast demand for the Middle East & Africa, North America, Asia Pacific, Latin America, and Europe for 3D mobile sensing hardware market with further country level bifurcation into the U.S., Canada, Mexico, UK, France, Germany, Poland, Russia, China, Japan, India, Brazil, and Argentina, among others.

Geographically, the 3D mobile sensing hardware market is categorized into Asia Pacific, North America, Europe, Latin America, and Rest of the World. North America holds the largest market share of 3D mobile sensing hardware market due to the rising adoption of smart electronic devices. Asia Pacific region is expected to hold a high growth rate during the forecast period. The increasing need and adoption rate of 3D mobile sensors in industrial robotics, healthcare, and entertainment sectors serves for the market development in the Asia Pacific. In addition, the 3D sensing feature on smartphone mainly used for facial recognition of the user, such as unlocking the device and mobile payment is another factor enhancing the demand for the 3D mobile sensing hardware in Asia Pacific region.

Some of the major players operating in the 3D Mobile Sensing Hardware Market are:

The competitive profiling of noticeable players of 3D mobile sensing hardware market includes company and financial overview, business strategies adopted by them, their recent developments, and product offered by them which can help in assessing competition in the market. Noticeable players included in the report are-

  • Infineon Technologies
  • PMD Technologies
  • Qualcomm Technologies
  • Himax Technologies
  • AMS AG
  • Sunny Opotech Co.
  • Heptagon
  • Lumentum Operations LLC
  • Microsoft Corporation
  • Google LLC
  • Lenovo
  • Apple Inc.
  • among others.

The report segments the global 3D mobile sensing hardware market into:

Global 3D Mobile Sensing Hardware Market: By Type

  • External sensors,
  • Built-in (Embedded, Internal) 

Global 3D Mobile Sensing Hardware Market: By Product

  • MEMS (Microelectromechanical System) 
  • Pressure Sensors
  • Microphones
  • Environmental Sensors
  • Fingerprint
  • ALS (Ambient Light Sensing)
  • CMOS
  • Others

Global 3D Mobile Sensing Hardware Market: By Application

  • Consumer Electronics
  • Security &Surveillance
  • Healthcare, Entertainment
  • Aerospace &Defense
  • Automotive
  • Industrial Robotics 
  • Others

Global 3D Mobile Sensing Hardware Market: By Region

  • North America
    • The U.S.
  • Europe
    • UK
    • France
    • Germany
  • Asia Pacific
    • China
    • Japan
    • India
  • Latin America
    • Brazil
  • Middle East and Africa

Table Of Content

Methodology

FrequentlyAsked Questions

The global 3D Mobile Sensing Hardware Market size was worth around USD 3.45 Billion in 2023 and is predicted to grow to around USD 27.24 Billion by 2032

compound annual growth rate (CAGR) of roughly 25.80% between 2024 and 2032.

The largest share of the 3D Mobile Sensing Hardware Market is held by Asia Pacific. Developing countries of Asia Pacific such as China, Japan, and India will be dominating the market scenario mainly due to the rising constructional activities. The growth of Asia-Pacific region is expected to be followed by the Middle East and North America. Also, significant growth is expected from Western Europe owing to the developments taking place in this region especially in countries such as Italy, Germany, the U.K, France, and Spain. However, growth in Africa, Latin America, and Eastern Europe is anticipated to be moderate over the forecast period.

Infineon Technologies, PMD Technologies, Qualcomm Technologies, Inc., Himax Technologies, Inc., AMS AG, Sunny Opotech Co., Ltd., Heptagon, Lumentum Operations LLC, Microsoft Corporation, Google LLC, Lenovo, and Apple Inc., among others.

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