Global 3D TSV Market To increase to around USD 13.4 billion by 2028

The global 3D TSV market was valued at around USD 5.5 billion in 2021 and is expected to increase to around USD 13.4 billion by 2028, with a CAGR of over 20% during the forecast period.

3D TSV is an acronym for 3-dimensional integration with through-silicon via and is used to perform system-level integration with reduced package size, better density for interconnection, and higher performance. It is an interconnected technique passing through a silicon wafer with the help of a vertical electrical connection which assists in lowering power consumption while delivering enhanced electrical performance. It has extensive use in microchip engineering or manufacturing that passes through a silicon die and has become an extremely important component in manufacturing 3-D packages and 3-D integrated circuits.

The global 3D TSV market was affected negatively due to the impact of Covid-19 since there was a major disruption in the supply chain and the availability of raw materials. The closure of multiple manufacturing units was a major reason for the global market to register slow growth in 2020.

After many years of constant innovation, high investments, and extensive R&D the global commercialized market has come to a point where even the most complex of technical products can be used with minimum effort. Technology has become accessible to all and the credit goes to the growing inclination towards products with compact sizes making them easy to use. Miniaturization of electronic items is critical to improving the overall effectiveness of the product by cutting down on the laboratory space required for manufacturing the product, it uses a lesser amount of raw materials without hampering the output efficiency. The rise in demand for miniaturized products is anticipated to aid the global 3D TSV market growth during the forecast period.

The high cost and productivity are the factors that are likely to restrain the growth of the market, however, the rising inclination toward LED packaging may create numerous opportunities for the growth of the global market during the forecast period. Thermal difficulties produced by a high degree of integration are a stumbling block to the 3D TSV market's growth.

The global 3D TSV market is classified into product, process realization, application, and region. Based on the product, the market is segregated into advanced LED packaging, imaging & optoelectronics, image sensors, CMOS, MEMS, and memory. Process realization segment is classified into via first, via middle, and via last. Based on the application, the market comprises military, aerospace, & defense sector, automotive sector, information & communication technology sector, and consumer electronics sector.

Asia-Pacific is anticipated to dominate the global 3D TSV market during the projection period. China is one of the strongest economies producing mass 3D TSV products because of the increased use of silicon wafers in manufacturing smartphones and in 5G technology. Countries like India and Japan are preferred regions for international 3D TSV manufacturers to set up manufacturing units owing to the availability of low-cost, skilled labor, and huge space. Growing initiatives taken by the government to attract more FDI is anticipated to aid the regional market growth.

North America is anticipated to grow significantly in the coming years owing to advanced technological infrastructure and a stable economy. This is also aided by the rising investments in the field of innovative electronic items to meet consumer demands.

Major players operating in the global 3D TSV market include ASE Group, Pure Storage Inc., Toshiba Corporation, Samsung Group, Taiwan Semiconductor Manufacturing Company Limited (TSMC), Intel Corporation, Broadcom Ltd, STMicroelectronics NV, United Microelectronics Corp., and Amkor Technology, among others.

Recent Developments

• In November 2020, ACM Research, a provider of wafer processing technologies for semiconductor and advanced wafer-level packaging (WLP) solutions, launched the Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications.

Browse the full “3D TSV Market By Product (Memory, MEMS, CMOS Image Sensors, Imaging & Opto Electronics, And Advanced LED Packaging), By Process Realization (Via First, Via Middle, And Via Last), By Application (Consumer Electronics Sector, Information & Communication Technology Sector, Automotive Sector, Military, Aerospace, And Defense Sector), And By Region – Global And Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, And Forecasts 2022 – 2028.” Report at https://www.zionmarketresearch.com/report/3d-tsv-market

Global 3D TSV market is segmented as follows:

By Product Type

• Memory
• MEMS
• CMOS
•  Image Sensors
• Imaging and Opto Electronics
• Advanced LED packaging

By Process Realization

• Via First
• Via Middle
• Via Last

By Application

• Consumer Electronics Sector
• Information and Communication Technology Sector
• Automotive Sector
• Military, Aerospace, and Defense Sector

By Region

• North America
  • The U.S.
  • Canada
• Europe
  • France
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Southeast Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • South Africa
  • Rest of Middle East & Africa

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