3D TSV Market Size, Share, Analysis, Trends, Growth, 2028

3D TSV Industry Prospective:

The global 3D TSV market was valued at around USD 5.5 billion in 2021 and is expected to increase to around USD 13.4 billion by 2028, with a CAGR of over 20% during the forecast period.

The study examines the drivers, constraints, and difficulties that the 3D TSV market faces, as well as their impact on demand throughout the forecast period. The report also looks into new prospective in the 3D TSV market.

3D TSV Market: Overview

3D TSV technology allows LSIs to be stacked to enable smaller goods like wearable gadgets easier to produce. Semiconductor manufacturers all around the globe are using 3D TSV technology to fulfill the rising need for functional integration. TSV is seeing a lot of use in a range of 2.5D and 3D packaging applications that require a lot of functionality and performance with the least amount of performance metric or energy. It is also being used to improve the memory and logic function of CMOS devices, non-memory, and electronics such as tablet PCs, smartphones, & televisions.

In electronics, TSV or through silicon via is an electrical connection which completely passes through a silicon wafer or dies. The wire bond and flip chips are replaced by TSV technology due to their high performance interconnects. This technology is used in a wide range of packaging applications and integrated circuits. The device density and the interconnect is substantially higher, and the length of the connections becomes shorter compared to alternatives such as package-on-package. 3D TSV technology provides high-speed signal processing, improved photodetection for 3D image sensing, and other applications such as 3D integrated circuits and 3D packages. In 3D packaging, TSV is used to connect multiple ICs together in a package. In the 3D integrated circuit, TSV helps to stack silicon wafers or dies and interconnect them vertically to behave as a single device.

3D TSV Market: Growth Drivers

Miniaturization of electrical devices is becoming increasingly popular thereby fostering the market growth

The growth of the 3D TSV market is fueled by the growing need for electronic device miniaturization as a result of improved compact size chip design. These items will be made possible by using hetero systems, which will improve the reliability of complex packaging. With ultra-small 3D packaged electronics and MEMS sensors, sensors can be placed almost everywhere and devices may be monitored in hostile environments in real-time to help enhance dependability and uptime. The 3D TSV market is driven by increasing demand for novel chip designs with increased attributes such as smaller form factor, high aspect ratio, and low power consumption. In addition to this, growing demand from numerous sectors including medical, automotive as well as defense is expected to boost the global market for 3D TSV market.

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3D TSV Market: Restraints

High cost and yield issues to limit the market growth

Even though the technological obstacles for 3D ICs are taking shape, the cost of the technology poses a significant barrier. TSVs have a number of advantages, including a reduced form factor, improved performance, and so on. However, they must contend with a slew of competing stacking technologies (PoP, PiP), as well as low-cost competitive connectivity methods like wire bonding. In addition to this, the most contentious topic in the business is the output of 3D integration. When dies are stacked, there is a danger that if one layer fails, the entire device will fail. Thus, high cost and productivity are the factors that are likely to restrain the growth of the market.

The expansion of the 3D TSV market for smartphones, tablets, and gaming devices across the globe is one of the major factor driving the global 3D TSV market. In addition, the growing trend of miniaturization of electronics device contributes to the growth of 3D TSV market considerably. Furthermore, increasing demand for high density and high-performance multifunctional microelectronics are expected to propel the growth of the 3D TSV market. However, high unit cost of 3D IC and 2.5D IC packaging is predicted to restrain the growth of 3D TSV market in the near future. Even so, growth in its application areas such as MEMS, optoelectronics, high-end LED solutions, and CMOS image sensors are expected to open new opportunities for the market in the coming years.

3D TSV Market: Opportunities

Increasing preference for LED packaging to fuel the market during the forecast period

The increased usage of LEDs in goods has prompted the development of gadgets with lower prices, higher density, and more energy. The adoption of 3D packaging through silicon via (TSV) technology, as opposed to 2D packaging, enables a high density of vertical interconnections. Future prospects are expected in the market, owing to advancements in implementation sectors such as CMOS image sensors, high-end LED solutions, and optoelectronics MEMS. Since this integrated TSV circuit minimizes link lengths, it requires less resistance, inductance, and parasitic capacity. It uses a combination of multifunctional and monolithic integration to deliver high-speed, low-power connectivity. Hence, the rising inclination toward LED packaging may create numerous opportunities for the growth of the global 3D TSV market during the forecast period.

3D TSV Market: Challenges

Thermal issues to be the major challenge for the market growth

Thermal difficulties produced by a high degree of integration are a stumbling block to the 3D TSV market's growth. Because the silicon via (TSV) is a critical link in 3D IC integration, the difference in coefficient of thermal expansion (CTE) between copper and silicon is greater than 10 ppm/K, resulting in thermal stress whenever a thermal load is placed.

3D TSV Market: Segmentation

The global 3D TSV market is classified into product, process realization, application, and region.

Based on the product, the market is segregated into advanced LED packaging, imaging & optoelectronics, image sensors, CMOS, MEMS, and memory. Process realization segment is classified into via first, via middle, and via last.

Based on the application, the market comprises military, aerospace, & defense sector, automotive sector, information & communication technology sector, and consumer electronics sector.

3D TSV Market: Report Scope

Recent Developments

• In November 2020, ACM Research, a provider of wafer processing technologies for semiconductor and advanced wafer-level packaging (WLP) solutions, launched the Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications.
• In October 2019, Samsung Electronics Creates the first of its kind 12-Layer 3D-TSV chip packaging technology in the market. The new method allows 12 DRAM chips to be stacked utilizing over 60,000 TSV holes while keeping the equivalent thickness as conventional 8-layer chips.

3D TSV Market: Regional Landscape

Asia Pacific to dominate the market during the forecast period

Geographically, Asia Pacific is estimated to dominate the global 3D TSV market during the forecast period. Australia, Singapore, Indonesia, South Korea, Japan, and China have all reported strong levels of production in the consumer electronics, automotive, and transportation sectors, which is a major source of demand for the 3D TSV market. Asia Pacific is among the world's most important manufacturing hubs. The expanding popularity of smartphones, as well as the desire for new memory technologies, has boosted the rise of computationally intensive consumer gadgets, opening up a slew of new prospects in this sector. Because silicon wafers are widely utilized in smartphone manufacturing, the launch of 5G technology is projected to enhance 5G smartphone sales, thereby expanding the telecommunications industry. On the other hand, increased R&D efforts linked to 3D IC design are assisting market expansion in North America and Europe.

3D TSV Market: Competitive Landscape

Major players operating in the global 3D TSV market include

• ASE Group
• Pure Storage Inc.
• Toshiba Corporation
• Samsung Group
• Taiwan Semiconductor Manufacturing Company Limited (TSMC)
• Intel Corporation
• Broadcom Ltd
• STMicroelectronics NV
• United Microelectronics Corp.
• Amkor Technology
• among others.

Global 3D TSV market is segmented as follows:

By Product Type

• Memory
• MEMS
• CMOS
•  Image Sensors
• Imaging and Opto Electronics
• Advanced LED packaging

By Process Realization

• Via First
• Via Middle
• Via Last

By Application

• Consumer Electronics Sector
• Information and Communication Technology Sector
• Automotive Sector
• Military
• Aerospace and Defense Sector

By Region

• North America

  • The U.S.
  • Canada
• Europe
  • France 
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Southeast Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • South Africa
  • Rest of Middle East & Africa