Advanced Packaging Market Size, Share, Trends, Growth and Forecast 2032

Advanced Packaging Market Insights

According to a report from Zion Market Research, the global Advanced Packaging Market was valued at USD 42.22 Billion in 2023 and is projected to hit USD 95.16 Billion by 2032, with a compound annual growth rate (CAGR) of 9.45% during the forecast period 2024-2032. This report explores market strengths, weakness, opportunities, and threats. It also provides valuable insights into the market's growth drivers, challenges, and the future prospects that may emerge in the Advanced Packaging industry over the next decade.

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Introduction

Advanced packaging has brought a paradigm shift in the chip manufacturing sector and is anticipated to bring huge transformation semiconductor fabrication methods. Apart from this, foundries have benefited to a large extent due to the advanced packaging automation.

Market Growth Dynamics

Growing necessity for high performing chips in various consumer electronics devices is likely to assist the advanced packaging market growth gain momentum over the forecast timeline. Furthermore, humungous demand for 3D Integrated Circuitand 2.5D packaging in chips that are utilized in smartphones will foster the demand for the advanced packaging during the ensuing years. In addition to this, large-scale acceptance of next-gen semiconductor tool is predicted to scale up the use of myriad advanced packaging methods, thereby steering the industry trends.

Furthermore, the changing customer trends for new packaging technologies and continuous breakthroughs made by key players for electronic items is likely to generate huge market demand over the forthcoming years. Additionally, the flourishing IoT sector is expected to culminate into demand for semiconductor packaging. Apparently, rise in the demand for consumer wearable goods and home equipment will favorably influence the market growth over the period from 2019 to 2025.

Our study provides the breakthroughs witnessed in the industry and the competitive business strategies implemented by the market participants for expanding their business portfolio. Let us discuss a few of the strategic moves made by the reputed brands influencing the advanced packaging market surge.

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ACM Research Launches Ultra SFP Application Tool For Advanced Packaging Solutions

In a major breakthrough that can positively impact the advanced packaging business, in March 2020, ACM Research, Inc., a key dealer in water processing services for both advanced wafer level packaging & semiconductors, launched an Ultra SFP App platform for advanced packing applications. Furthermore, the Ultra SFP App is devised to resolve the problems pertaining to output caused as a result of through- silicon via methods along with fanning out wafer level packaging issues that hamper fanning out wafer level packaging procedures.

Advanced Packaging Market: Report Scope

Asia Pacific To Contribute Massively Towards Overall Market Surge By 2025

The growth of the regional market during the forecast timeline is owing to huge end-user demand for advanced packaging in the countries like China and India.

Key players profiled in global advanced packaging market include International Business Machines Corporation (IBM), Amkor Technology, ASE Group, Precision Industries Co., Ltd., Qualcomm Technologies, Inc., STATS ChipPAC Pte. Ltd., Siliconware, SSS MicroTec AG., Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., and Taiwan Semiconductor Manufacturing Company.

The global advanced packaging market is segmented as follows:

By type

• 3D Integrated Circuit
• 2D Integrated Circuit
• 2.5D Integrated Circuit
• Wafer Level Chip Scale Package
• Flip Chip
• Fan Out Silicon in Package
• Fan Out Wafer Lever Package
• Others

By industry vertical

• Consumer Electronics
• Automotive & Transport
• IT & Telecommunication
• Industrial
• Healthcare
• Aerospace & Defense
• Others

By Region

• North America
  • The U.S.
  • Canada
• Europe
  • France
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Southeast Asia
  • Rest of Asia Pacific
• Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
• Middle East & Africa
  • GCC
  • South Africa
  • Rest of Middle East & Africa