Capillary Underfill Material Market Size, Share, Trends, Analysis To 2032

Capillary Underfill Material Market Insights

According to the report published by Zion Market Research, the global Capillary Underfill Material market was valued at USD 544.83 Million in 2023 and is predicted to reach USD 952.22 Million by the end of 2032. The market is expected to grow with a CAGR of 6.4% during the forecast period. The report analyzes the global Capillary Underfill Material Market's growth drivers, restraints, and impact on demand during the forecast period. It will also help navigate and explore the arising opportunities in the Capillary Underfill Material market.

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Capillary Underfill Material Market: Overview

The underfill materials are the fused formulations of the organic polymers and the inorganic fillers. It is widely used in semiconductor packaging to achieve desirable thermomechanical properties. The polymer adhesives that are used in the underfill materials distribute evenly the mechanical stress at the joint owing to the change in the thermal expansion factors. Abundant phenolic and amine based epoxy is used in the semiconductor packaging sector for underfill materials. Some of the techniques that are used in the underfill materials include capillary underfill, molded underfill, and no flow underfill.

Capillary Underfill Material Market: Facts

Henkel provided advanced capillary flow underfill materials for the CSP, flip chip, and BGA devices, which help in lowering stress, enhance performance and improve reliability. It is required for flip-chip applications so that the stress is redistributed away from the joints of the solder, which helps in extending the cycle life and the thermal aging.

Capillary Underfill Material Market: Segmentation

The global market for capillary underfill material is fragmented by its product type and application.

On the basis of the product type, the global market is segregated into molded underfill material, no flow underfill material and others.

On the basis of application, the market is categorized into chip scale packaging, flip chips, ball grid array, and others.

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Capillary Underfill Material Market: Growth Factors

The key factor that is driving the capillary underfill material market is the latest advancements that are made in the electronic sector. In the semiconductor packaging industry, rework ability and high thermal constancy are the characteristics that are preferred for the underfill material. It is used in several packaging techniques, which include ball grid array, chip scale packaging, flip chip, and others. The semiconductor packaging industry is expected to expand significantly in the coming years, thus boosting the growth of the capillary underfill material market.

Capillary Underfill Material Market: Report Scope

Capillary Underfill Material Market: Regional Analysis

The region that is dominating the capillary underfill material market is Asia-Pacific region, which is followed by Europe and North America. The dominance by the Asia Pacific region will continue in the coming years too. Asia Pacific region is a market that has a wide range of opportunities in terms of revenue. The countries that are contributing to the capillary underfill market in Asia Pacific region include China, South Korea, and Taiwan. Regions such as Latin America, the Middle East and Africa are witnessing sluggish market growth.

Capillary Underfill Material Market: Competitive Players

The key market players that are involved in the capillary underfill material market include

• Zymet
• Epoxy Technology Inc.
• H.B. Fuller
• Henkel Ag & Co. Kg
• Namics Corporation
• Nordson Corporation
• Yincae Advanced Material
• LLC
• Master Bond
• others

The Global Capillary Underfill Material Market segments are as follows:

By Product Type

• molded underfill material
• no flow underfill material
• others.

By Application

• chip scale packaging
• flip chips
• ball grid array
• others.

Capillary Underfill Material Market: Regional Segment Analysis

• North America
  • U.S.
• Europe
  • UK
  • France
  • Germany
• Asia Pacific
  • China
  • Japan
  • India
• Latin America
  • Brazil
• The Middle East and Africa

What Reports Provide

• Full in-depth analysis of the parent market
• Important changes in market dynamics
• Segmentation details of the market
• Former, on-going, and projected market analysis in terms of volume and value
• Assessment of niche industry developments
• Market share analysis
• Key strategies of major players
• Emerging segments and regional markets
• Testimonies to companies in order to fortify their foothold in the market.