Market Size in 2023 | Market Forecast in 2032 | CAGR (in %) | Base Year |
---|---|---|---|
USD 6.61 Billion | USD 14.07 Billion | 8.75% | 2023 |
The global electronic thermal management materials market size was worth around USD 6.61 billion in 2023 and is predicted to grow to around USD 14.07 billion by 2032 with a compound annual growth rate (CAGR) of roughly 8.75% between 2024 and 2032.
The report covers forecast and analysis for the global electronic thermal management materials market on a global and regional level. The research report presents a comprehensive valuation of the market, competition, opportunities, emerging trends, and industry-validated market figures. The study provides historic data of 2018 to 2022 along with a forecast from 2024 to 2032 based on volume (Kilo Tons) and revenue (USD Billion).
Electronic thermal management materials are specialized substances designed to efficiently dissipate heat generated by electronic devices and systems. These materials include thermal interface materials (TIMs), heat sinks, thermal gap fillers, and phase change materials (PCMs), each playing a crucial role in maintaining optimal operating temperatures and preventing overheating. By enhancing thermal conductivity and minimizing thermal resistance, these materials ensure the reliability, performance, and longevity of electronic components, which is particularly vital in high-power and high-density applications such as data centers, consumer electronics, and automotive electronics.
The global electronic thermal management materials market is likely to have significant growth and is anticipated to grow at a noteworthy rate within the forecast period. There is an immense scope in the electronic thermal management materials market owing to the property of enhancing the heat dissipation of an electronic assembly, variety of applications and growing demand in the market. The electronic thermal management materials are major constituents in the electronic assembly as they enhance consistency and improve the performance of the electronic devices. Owing to the parameters such as improved functioning, and reduction in the size of electronic devices, the electronic thermal management materials have become a crucial part of modern electronic systems which is expected to drive the global electronic thermal management materials at a faster pace within the forecast period.
Growth factors driving the electronic thermal management materials market include the increasing demand for miniaturized and high-performance electronic devices, which generate more heat and require advanced cooling solutions. The rapid expansion of sectors like consumer electronics, automotive electronics, and telecommunications fuels the need for efficient thermal management. Additionally, technological advancements in materials science, such as the development of nanomaterials and advanced composites, are enhancing the thermal conductivity and performance of these materials. Regulatory standards and the push for energy-efficient solutions also contribute to market growth by encouraging the adoption of more effective thermal management technologies.
The significant rise in the demand for electronic thermal management materials from the telecommunication and aerospace industries is expected to fuel the market growth within the forecast period. The electronic thermal management materials are widely used in routers, transmission equipment, power supplies, digital & analog switches, microwave radio, and controllers in the telecommunication and aerospace industries which are estimated to give significant growth to the global electronic thermal management materials market in the forecast period. The factors which might hamper the electronic thermal management materials market is the volatility in raw material prices.
The global electronic thermal management materials market has been segmented on the basis of product and end-use industry.
Based on the product, the electronic thermal management materials market is classified into conductive pastes, conductive tapes, phase change materials, gap fillers, and thermal greases. The conductive paste segment is likely to have the highest market share owing to the excellent thermal conductivity, electrical conductivity, superior adhesive strength and functional protection to the electronic components. The use of conductive pastes also reduces the requirement for clips and screws in the electronic circuits thereby reduce the weight of the electronic device. The rising demand for low weight and efficient thermal management materials is expected to boost up the growth of this segment within the forecast period.
Based on the end-use industry, electronic thermal management materials market is classified into consumer electronics, automotive, aerospace, healthcare, and telecommunication industries. The consumer electronics segment is expected to be the leading segment in the global electronic thermal management materials market within the forecast period, owing to the rising penetration of consumer electronics in the developing nations across the globe.
Report Attributes | Report Details |
---|---|
Report Name | Electronic Thermal Management Materials Market? Size Report |
Market Size in 2023 | USD 6.61 Billion |
Market Forecast in 2032 | USD 14.07 Billion |
Growth Rate | CAGR of 8.75% |
Number of Pages | 188 |
Forecast Units | Value (USD Billion), and Volume (Units) |
Key Companies Covered | Boyd, Laird PLC, Henkel AG & Company, Honeywell International Inc., Lord Corporation, European Thermodynamics Ltd, Marian Inc, Darcoid company, Parker Chomerics, Amerasia International (AI) Technology Inc, 3M, DuPont, Wacker AG, and Dr Dietrich Muller Gmbh among others. |
Segments Covered | By Product, By End User Industry, and By Region. |
Base Year | 2023 |
Historical Year | 2018 - 2022 |
Forecast Year | 2024 - 2032 |
Customization Scope | Avail customized purchase options to meet your exact research needs. Request For Customization |
Geographically, the Asia Pacific region is expected to have maximum market share in the electronic thermal management materials market owing to the increasing demand for the consumer electronics and automobiles sectors. According to the National Invest Promotion & Facilitation Agency, the Indian electronics market is one of the largest electronics markets in the world anticipated reaching $ 400 Billion by 2025. China, Japan, South Korea, and Taiwan are other foremost electronic manufacturing countries in the Asia-Pacific region with China being the largest one. North America and Europe are other major regions for the global thermal management materials market.
By Product Segment Analysis
By End-Use Segment Analysis
By Regional Segment Analysis
FrequentlyAsked Questions
Electronic thermal management materials are specialized substances designed to efficiently dissipate heat generated by electronic devices and systems.
According to study, the global electronic thermal management materials market size was worth around USD 6.61 billion in 2023 and is predicted to grow to around USD 14.07 billion by 2032.
The CAGR value of electronic thermal management materials market is expected to be around 8.75% during 2024-2032.
Asia Pacific has been leading the global electronic thermal management materials market and is anticipated to continue on the dominant position in the years to come.
The global electronic thermal management materials market is led by players like Boyd, Laird PLC, Henkel AG & Company, Honeywell International Inc., Lord Corporation, European Thermodynamics Ltd, Marian Inc, Darcoid company, Parker Chomerics, Amerasia International (AI) Technology Inc, 3M, DuPont, Wacker AG, and Dr Dietrich Muller Gmbh among others.
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