Market Size in 2022 | Market Forecast in 2030 | CAGR (in %) | Base Year |
---|---|---|---|
USD 278.16 Million | USD 356.91 Million | 3.28% | 2022 |
FrequentlyAsked Questions
A flip-chip bonder is a technique for connecting dies such as semiconductor equipment, integrated chips, micro-electromechanical systems, and integrated passive devices with each other. Then these interconnected dies are connected to external circuitry through the use of solder bumps. Moreover, a flip-chip bonder is also referred to as a controlled collapse chip connection and is known as C4. For the record, the onset of new technologies such as smart grids, smart manufacturing, and smart grids will enhance the demand for flip-chip bonders.
The global flip chip bonder market growth is owing to a rise in the use of flip-chip bonders for high-frequency components.
According to a study, the global flip chip bonder industry size was $278.16 million in 2022 and is projected to reach $356.91 million by the end of 2030.
The global flip chip bonder market is anticipated to record a CAGR of nearly 3.28% from 2023 to 2030.
The European flip chip bonder industry is set to register the highest CAGR over the forecasting timeline owing to a rise in the demand for semiconductors in the various end-user industries such as consumer electronics, automotive, healthcare, telecommunications, and aerospace & defense.
The global flip chip bonder market is led by players such as Yamaha Motor Co., Ltd., SHIBUYA CORPORATION, TLMI Corp, Flipchip International LLC, BE Semiconductor Industries N.V., TPT Wire Bonder, Flip Chip Electronics Pvt. Ltd, ficon TEC Service GmbH, Finetech, Trans Technology Pte Ltd, BESI, AMICRA Microtechnologies, ASMPT, Muehlbauer, CeNSE, Hamni, Athlete FA, CoorsTek Semiconductor, K&S, Shibaura, QP Technologies, Advotech Company, Inc., and SET.
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