Market Size in 2024 | Market Forecast in 2034 | CAGR (in %) | Base Year |
---|---|---|---|
USD 3.50 Billion | USD 5.98 Billion | 5.48% | 2024 |
FrequentlyAsked Questions
Quad-flat-no-lead (QFN) packaging is a surface-mount integrated circuit (IC) packaging solution.
The global quad-flat-no-lead packaging market is expected to be fueled by the rising use of technology in the wireless communications sector.
According to study, the global quad-flat-no-lead packaging market size was worth around USD 3.50 billion in 2024and is predicted to grow to around USD 5.98 billion by 2034.
The CAGR value of quad-flat-no-lead packaging market is expected to be around 5.48% during 2025-2034.
The global quad-flat-no-lead packaging market will be led by Asia-Pacific during the forecast period.
The global quad-flat-no-lead packaging market is led by players like National Semiconductor, Amkor Technology, Wevolver, ASE Group, Komachine, ASAT Holdings, SFA Semicon, Alumina PCB, Texas Instruments, Flex PCB, ROHM Semiconductor, PCB Technologies, Microchip Technology, iC-Haus, and Atmel.
The report explores crucial aspects of the quad-flat-no-lead packaging market, including a detailed discussion of existing growth factors and restraints while browsing future growth opportunities and challenges that impact the market.
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