Market Size in 2022 | Market Forecast in 2030 | CAGR (in %) | Base Year |
---|---|---|---|
USD 978 million | USD 1405 million | 4.63% | 2022 |
FrequentlyAsked Questions
Surface-mount technology (SMT) is a common term used in the electronics industry. It describes the method used to attach components, also known as surface-mounted components (SMCs) on printed circuit boards (PCB).
The global convection reflow soldering oven market is expected to grow owing to the growing demand for miniaturization in the electronics industry.
According to study, the global convection reflow soldering oven market size was worth around USD 978 million in 2022 and is predicted to grow to around USD 1405 million by 2030.
The CAGR value of convection reflow soldering oven market is expected to be around 4.63% during 2023-2030.
The global convection reflow soldering oven market is projected to be led by North America during the forecast period with the US acting as the major contributor.
The global convection reflow soldering oven market is led by players like Nordson Corporation, JLW Electronics, PVA Tepla America, Heller, ANTOM, SEHO, VIRTRONIC, Tamura, Nihon Handa, BTU, Shenzhen Riding, Vitronics Soltec, and many more.
The global convection reflow soldering oven market explores crucial aspects of the convection reflow soldering oven market including detailed discussion of existing growth factors and restraints while also browsing future growth opportunities and challenges that impact the convection reflow soldering oven market.
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