Market Size in 2022 | Market Forecast in 2030 | CAGR (in %) | Base Year |
---|---|---|---|
USD 1400 Million | USD 2300 Million | 6.12% | 2022 |
FrequentlyAsked Questions
Test & burn-in sockets are used for inspection of integrated circuit (IC). These sockets connect integrated circuits (ICs) to the inspection boards, without any soldering. There are two types of inspection sockets, including, test sockets & burn-in sockets. Before being supplied to the customer, the produced ICs must be tested. During this production phase, a number of tests, including burn-in, fuse, functional, failure analysis, etc., take place.
The global test & burn-in socket market cap may grow owing to the rising demand for semiconductors from automotive, consumer electronics, telecommunication & information technology. Significant growth opportunities can be expected due to the rising innovations in the test & burn-in socket & 5G industry.
According to study, the global test & burn-in socket market size was worth around USD 1400 million in 2022 and is predicted to grow to around USD 2300 million by 2030.
The CAGR value of the test & burn-in socket market is expected to be around 6.12% during 2023-2030.
The global test & burn-in socket market growth is expected to be driven by Asia Pacific. Currently, Asia Pacific is the highest revenue-generating market, across the globe, owing to the huge footprint of the semiconductor production in regional countries such as Taiwan, China, and others.
The global test & burn-in socket market is led by players like 3M, Advanced Interconnections Corp., ADVANTEST CORPORATION, Ardent Concepts, Aries Electronics, C.C.P. Contact Probes Co., Ltd., Cohu, Inc, CONTECH SOLUTIONS INC., Enplas Corporation, E-tec Interconnect, Exatron, FoundPac Technologies Sdn Bhd., GOLD TECHNOLOGIES, INC., Ironwood Electronics, ISC Co., Ltd., JC CHERRY INC., JF TECHNOLOGY BERHAD, Johnstech, LEENO INDUSTRIAL INC., Loranger International Corp., M specialties LLC., Megatone Electronics Corp., MICRONICS JAPAN CO., LTD., Mill-Max Mfg. Corp., OKINS ELECTRONICS CO. LTD., Qualmax Inc., RIKA DENSHI CO., LTD., Robson Technologies, Inc., Sensata Technologies, Inc., Smiths Interconnect (Plastronics), TE Connectivity, WinWay Tech. Co., Ltd., Yamaichi Electronics Co., Ltd., and Yokowo co., ltd.
The report incorporates demand & in-depth market insights on the global test & burn-in socket industry and analyzes the market’s drivers, restraints/challenges, and the effect they have on the demands during the projection period. In addition, the report explores emerging opportunities in the test & burn-in socket industry. Moreover, the study covers the competitive landscape, as well as related geopolitical insights, for test & burn-in socket industry.
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