3D TSV Market Size, Share, Analysis, Trends, Growth, 2032

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Methodology

Free Analysis

In electronics, TSV or through silicon via is an electrical connection which completely passes through a silicon wafer or dies. The wire bond and flip chips are replaced by TSV technology due to their high performance interconnects. This technology is used in a wide range of packaging applications and integrated circuits. The device density and the interconnect is substantially higher, and the length of the connections becomes shorter compared to alternatives such as package-on-package. 3D TSV technology provides high-speed signal processing, improved photodetection for 3D image sensing, and other applications such as 3D integrated circuits and 3D packages. In 3D packaging, TSV is used to connect multiple ICs together in a package. In the 3D integrated circuit, TSV helps to stack silicon wafers or dies and interconnect them vertically to behave as a single device.

The expansion of the 3D TSV market for smartphones, tablets, and gaming devices across the globe is one of the major factor driving the global 3D TSV market. In addition, the growing trend of miniaturization of electronics device contributes to the growth of 3D TSV market considerably. Furthermore, increasing demand for high density and high-performance multifunctional microelectronics are expected to propel the growth of the 3D TSV market. However, high unit cost of 3D IC and 2.5D IC packaging is predicted to restrain the growth of 3D TSV market in the near future. Even so, growth in its application areas such as MEMS, optoelectronics, high-end LED solutions, and CMOS image sensors are expected to open new opportunities for the market in the coming years.

The global 3D TSV market is classified based on the product, end-users, and region. Memory, MEMS, CMOS image sensors, imaging and optoelectronics, advanced LED packaging, and others are the product segment of 3D TSV market. On the basis of end-user, the global 3D TSV market is segmented into consumer electronics sector, information, and communication technology sector, automotive sector, military, aerospace and defense, and other sectors. All the segments are analyzed based on present and future trends and the market is projected from 2018 to 2024. Based on regions, the 3D TSV market is categorized into the Asia Pacific, North America, Latin America, Europe, and the Middle East and Africa with its further categorization into the US, the UK, Germany, France, China, India, Japan, and Brazil.

In terms of revenue, Asia Pacific held the largest market share for the global 3D TSV market in 2017 followed by North America. The key contributing countries for the growth of the 3D TSV market in the Asia Pacific region are China, India, and Taiwan owing to the demand from consumer electronics, automotive, and transportation sectors. Moreover, the adoption of 3D TSV integration in MEMS and CMOS image sensors for consumer applications is predicted to drive North America as well as the European 3D TSV market significantly in the near future. The Middle East and Africa are also estimated to show noticeable growth in the near future. Saudi Arabia is expected to be the most opportunist country in the Middle East.

The major players operative in global 3D TSV market includes Amkor Technology, United Microelectronics Corp., Intel Corporation, Samsung Electronics Co. Ltd., Toshiba Corp., Pure Storage Inc., Broadcom Ltd., Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics NV, and Jiangsu Changing Electronics Technology Co. Ltd., amongst others.